Developer Home Contents Search Feedback Support Intel(r)


TSOP Test Clip

Emulation Technology, Inc.


Architecture:
Type :
Last Update:

Flash Memory Components Boot Block
Test Accessories (Flash)
4/24/98 4:26:57 PM

Vendor Information



Tool Description:

This new test clip is specifically designed for probing Thin Small Outline Packages (TSOP). It is the first clip-on device created for TSOPs. Its low-profile design and use of directionally conductive elastomeric connectors make it ideal for probing units up to .030" apart with a lead pitch of 0.50mm-0.55mm. Best of all, there is an infinite amount of probing applications. A male-to-male socket comes standard with every clip. You can choose an alternate method of lead connection such as a flex test point connector or rigid test point connector. If you have multiple probing needs, all connector options are available in a kit.

Tool Features:

  • Minimum clearance of .030" (0.76mm) for side-by-side connection

  • Uses directionally conductive elastomeric connectors instead of pins

  • Low profile offers reliable connection

  • Infinite number of probing applications

  • Supports 28- to 56-pin TSOP packages
  • File Attachments:

    TSOP.PDF - TSOP Test Clip product brief

    Supported Device Detail Matrix:

    Part & Package

    28F001BX - TSOP-32 ld
    28F002BC - TSOP-40 ld
    28F002BX/BL - TSOP-40 ld
    28F004BX/BL - TSOP-40 ld
    28F200BX/BL - TSOP-56 ld
    28F400BX/BL - TSOP-56 ld



    Vendor Information:


    Emulation Technology, Inc.

    2344 Walsh Avenue, Building F
    Santa Clara , CA 95051-1301
    USA
    (408) 982-0660

    Tech : (408) 982-0660
    Email : ET@pmail.emulation.com
    Fax : (408) 982-0664
    Toll Free : (800) 995-4381
    BBS : (408) 982-9044
    URL : http://www.emulation.com

    Contact the vendor above for the latest Distributor information




    * Legal Information © 1998 Intel Corporation